Description

FEATURES AND BENEFITS
? Designed for use with OSP protected copper pads
? Fully compatible with ALPHA UP-78 solder paste residue
APPLICATION GUIDELINES
Formulated for standard and fine pitch printing through stencil apertures. Suitable for use
across a wide variety of process settings, including rework applications with BGA?s and other
components. ALPHA UP-78 paste flux is especially suitable for printing on assemblies that
have OSP coated copper pads.
Cleaning
Although designed as a no clean flux system, the residue may be cleaned with BIOACT? ECULTRA or BIOACT EC7-R or 10% ALPHA 2110 saponifier with water. Incidental water washing
will not cause the residues to become cloudy in appearance; as long as no alcohols are present
in the wash water. Production stencils or pin transfer equipment can be cleaned with BIOACT
SC-10.