SIPLACE CA
Chip assembly and SMT placement in a single machine
Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement. Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.