DESCRIPTION
ALPHA OM-525 is a low temperature solder paste technology designed to enable a single
reflow application for assembly of double sided board. Its key attribute is excellent no-solder
drip phenomena during the reflow process. ALPHA OM-525 solder paste version with ALPHA
SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profiles
between 155 ?C and 190 ?C. ALPHA SBX02 alloy has improved Mechanical Strength and
Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA OM-525
provides excellent electrical resistivity, exceeding industry standards.
This product enables the elimination of an extra wave or selective wave soldering process when
temperature sensitive through-hole components are used in an assembly. The benefits are
increased daily throughput, eliminate the need for managing bar solder and wave soldering flux
supplies and eliminate the need for pallets. In addition, it allows the desired obsolescence of an
extra SMT process. These eliminations can significantly lower the cost of producing an
electronic assembly. The alloys yield very low voiding BGA solder joints, even when a traditional
SAC alloy sphere is used.
All components used with ALPHA OM-525 must be lead-free to eliminate the formation of
tin/lead/bismuth phase which has a melting point under 100 ?C.