ALPHA? OM-338 SERIES
Lead-Free Solder Paste
DESCRIPTION
ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of
applications. ALPHA OM-338?s broad processing window is designed to minimize transition
concerns from tin/lead to lead free solder paste. This material is engineered to deliver the
comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability
performance across various board designs and, particularly, with ultrafine feature repeatability
(11 mil Squares) and high throughput applications.
Outstanding reflow process window delivers good soldering on CuOSP with excellent
coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and
mid-chip solder ball performance. ALPHA OM-338 is formulated to deliver excellent visual joint
cosmetics. Additionally, ALPHA OM-338?s capability of IPC Class III for voiding and ROL0 IPC
classifications ensures maximum long-term product reliability.
* Although the appearance of these lead-free alloys will be different to that of tin-lead, the
mechanical reliability is equal to or greater than with that of tin-lead or tin-lead-silver.