SIPLACE OSC Package
Master all challenges
With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.
Placement forces of up to 100 N
Snap-in recognition
Real-time 3D measurement of contact pins
Automatic placement speed optimization
Automatic illumination setting for OSC components
Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
Component weight up to 300 g
NEW: Measure moment of inertia