PoP
assemblies allow for higher electronic functionality per unit circuit
board area, and allows low cost product memory customization,
and highly flexible manufacturing.
ALPHA PoP-959 was designed to minimize expensive rework
ALPHA PoP-959 maintains its rheology, even under frequentexposure to high shear, for at 24 hours.
To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, ALPHA PoP. 959 solder paste provides flux and solder powder, to help minimize defects associated with non-planar processor/memory combinations during the reflow process. The use of paste can help reduce costly defects associated with soldering known good memory devices to known good processor packages by bridging gaps that PoP flux alone may not. ALPHA PoP-959 was designed to minimize expensive rework
and scrap by providing highly repeatable paste volumes to Chip Scale (CSP) memory packages, while offering resistance to shear forces associated with PoP dip application equipment. ALPHA PoP-959 maintains its rheology, even under frequent exposure to high shear, for at 24 hours. This means highly reproducible volumes of paste pick up in normal PoP dipping applications, reducing defects, increasing yields and reducing scrap. ALPHA PoP-959 is a no-clean, lead-free solder paste. By optimizing ultra-fine solder powder
and physical properties of flux, it is ideal for 150 to 300u offset Chip Scale packages, while leaving a clear, colorless, residue with very high electrical resistivity. READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT
| brand | alpha |
|---|---|
| Technical Data | https://www.macdermidalpha.com/sites/default/files/2021-09/alpha-pop-959-solder-paste-en-03aug20-tb.pdf |
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