ALPHA? OM-338-PT Solder Paste
Fine-Feature, Zero-Halogen, Pin-Testable Lead-Free Solder Paste
DESCRIPTION
ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of
applications. ALPHA OM-338-PT?s broad processing window is designed to minimize transition
concerns from tin-lead to lead-free solder paste. This material is engineered to deliver the
comparable performance to a tin-lead process. ALPHA OM-338-PT yields excellent print
capability performance across various board designs; particularly with ultra-fine feature
repeatability (11 mil squares) and high ?through-put? applications. ALPHA OM-338-PT is
formulated to offer increased in-circuit pin test yields versus ALPHA OM-338 without
compromising electrical reliability.
Outstanding reflow process window delivers good soldering on CuOSP with excellent
coalescence on a broad range of deposit sizes, excellent random solder ball resistance and
mid-chip solder ball performance. ALPHA OM-338-PT is formulated to deliver excellent visual
joint cosmetics. Additionally, ALPHA OM-338-PT?s capability of IPC-7095 Class 3 for voiding
and ROL0 IPC classifications ensures maximum long-term product reliability.
* Although the appearance of these lead-free alloys will be different to that of tin-lead, with
mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.