Description

FEATURES & BENEFITS
Long Stencil Life: consistent performance for at least 8 hours of continuous printing without
addition of new paste
Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
Wide Reflow Profile Window: allows best quality solderability of complicated, high density
PCB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175
to 185 ?C
Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
Excellent Coalescence and Wetting Performance: coalesced 180?m circle deposit, even
at high soak profile environment
Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using
long/high thermal soaking, without charring or burning
Excellent Voiding Performance: Meets IPC7095 Class III Requirement
Halogen Content: Zero Halogen, no halogen intentionally added
Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free
requirements (see table below), as well as TOSCA & EINECS