Description

ALPHA? OM-325
Fine Feature Lead-Free Solder Paste
DESCRIPTION
ALPHA OM-325 is a Lead-Free, no-clean solder paste designed for ?-Fine feature printing and
reflow. ALPHA OM-325?s has a wide processing window that provides a surface mount process
solution for component metrics down to 0402mm (01005inch). ALPHA OM-325 yields excellent
print capability performance across various board designs and particularly with ?-Fine Feature
repeatability of 0.16mm (6.5mil circles) across 8 hours of production.
Outstanding reflow process window, even with high soak profiles (60 to 90 seconds at 180 to
190 ?C) in air and nitrogen atmosphere delivers good soldering on Cu OSP with excellent
coalescence on broad range of deposits sizes, excellent random solder ball resistance, and
mid-chip solder ball performance. ALPHA OM-325?s cosmetic capabilities* deliver excellent
visual inspection.

Additionally, ALPHA OM-325?s capability of IPC Class III for voiding and ROL-0 IPC
classifications ensures maximum long-term product reliability.
* Although the appearance of lead-free alloys will be different from that of tin-lead, with
mechanical reliability equal to or greater than that of tin-lead or tin-lead-silver.

FEATURES & BENEFITS
? Excellent print consistency with high process capability index across all board designs.
? Excellent stencil life with consistent performance over 8 hours of printing.
? Maximized reflow yield for Lead-Free processing, allowing full deposit coalescence at
circular apertures as small as 0.16mm (0.0065?) 1 in diameter.
? Wide reflow profile window allowing good solderability of complicated high-density PWB
assemblies both in air or nitrogen reflow.
? Excellent solderability enabling the process to handle the most difficult wetting requirements
such as Pd finish and other Lead Free PWB/components surface finishes.
? Excellent solder and flux cosmetics after reflow soldering even with a long/high thermal
soaking.
? Reduction in random solder balling levels, minimizing rework and increasing first time yield.
? Meets highest IPC voiding performance classification of Class III under certain reflow
conditions.
TECHNICAL BULLETIN
ALPHA OM-325
Technical Bulletin
Issue: 10 January 2020 Page 2 of 6
? Excellent component placement re-alignment during reflow, even with most demanding
reflow setting.
? Excellent reliability properties, halide-free material graded ROL0 according to IPC
classification.