Product Overview
ALPHA CVP-520 is designed for near eutetic low temperature alloys such as SnBi0.4Ag to enable peak reflow profiles between 155?C and 190?C. The flux residue is clear, colorless, and provides excellent electrochemical reliability.

The carefully selected alloy in ALPHA CVP-520 offers the lowest melting point, lowest pasty range during melting and re-solidification, offering maximum resistance to thermal cycle based fatigue in traditional low temperature alloy applications. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.

All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100?C.