ALPHA? OM-340-SL PASTE FLUX
No-Clean, Rework and BGA Flux
DESCRIPTION
ALPHA OM-340-SL is a no-clean flux engineered to be used in the placement and reflow of
lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to
hold the BGA in place. After reflow, the residue is clear and colorless. This paste flux can also
be used in the rework of components.
FEATURES AND BENEFITS
? Wide Reflow Profile Window: allows best quality solderability of complicated, high density
PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as
175 to 185 ?C
? Excellent Flux Residue Cosmetics: after reflow soldering, even using long/high thermal
soaking, without charring or burning
? Halogen Content: Zero-Halogen, no halogen intentionally added
? Residue: Excellent Pin Testing property and Passed JIS Copper Corrosion Test
? Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free
requirements, as well as TSCA & EINECS
| brand | alpha |
|---|---|
| Technical Data | https://www.macdermidalpha.com/sites/default/files/2021-10/alpha-om-340-sl-paste-flux-en-13mar20-tb.pdf |
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