DESCRIPTION
This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for
BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place.
After reflow the residue is clear, colorless. This paste flux can also be used in the rework of
components.
APPLICATION GUIDELINES
The flux may be applied by screen printing or pin transfer (substrate) or doctor blade / dip
coating (package). It can also be dispensed.
Cleaning
Although designed as a no-clean flux system, the reflowed residue may be cleaned with
BIOACT? SC-10E, BIOACT? SC-30, ALPHA SM-110, ALPHA SM-110E, ALPHA BC-2200,
Kyzen Micronox? MX2501, and Zestron? ATRON? AC205. Production stencils or pin transfer
equipment can be cleaned with BIOACT? SC-10.
| brand | alpha |
|---|---|
| Technical Data |
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