ASMPT SMT Equipment Supplied by Priben Distribution

PRIBEN Distribution an official service provider for the ASMPT brand and products

Comprehensive planning , sourcing, processing and installation on all ASMPT products

ASMPT Printer Solutions

DEK TQ

DEK TQ L

DEK NeoHORIZON

ASMPT Inspection Solutions

Process Lens / Process Lens HD (SPI)

Process Expert

SIPLACE SX

Our placement solution for high-mix electronics production

SIPLACE TS

Siplace TX micron High speed and high accuracy for submodules and SiPs

SIPLACE TS

Siplace Tray Unit Non-stop feeding of components in a tray with a compact design

SIPLACE X S

The benchmark in high-volume production

SIPLACE CA

Chip assembly and SMT placement in a single machine

The compact, fully automated storage system. With its large capacity, modular scalability, high flexibility and perfect integration into our Open Automation concept, the Material Tower from ASMPT is the storage solution of the future for the integrated smart factory and its fully automated material flow processes.

ASMPT Storage Solutions (Material Tower)

Unique, RFID-based all-in-one solution for monitoring stencil lifecycles

Declines in tension and surface quality, which are normal as stencils age, reduce the quality, yield and process stability of the solder paste printing process. The RFID tags provided by ASMPT make it possible for the first time to monitor the service life of stencils as easily and conveniently as seamlessly. DEK printers equipped with the Smart Stencil option record each printing cycle on the RFID tag even if the stencil is used in different lines. Never again will the use of outdated stencils hurt the quality and efficiency of your printing process.

Easy and fast ordering via our stencil online order system
Process stability through seamless service life management
For stencils from all manufacturers (customers can apply RFID tags themselves)
Ability to store a stencil profile
Customer-definable warning and maximum thresholds

Discover the advantages of Smart Stencils.

ASMPT Packaging Solutions

Solutions for Advanced Packaging in Electronics Production

New applications in electronics drive advances in miniaturization, component density and modularization while the pressure on costs keeps rising. In response, semiconductor makers and contract manufacturers resort more and more to advanced packaging technologies like fan-out wafer level and fan-out panel level packaging (FOWL/FOPLP), these formats are increasingly combined with 3D and SiP technologies. This permits them to develop microelectronics with more functional density as well as outstanding electrical and thermal properties. Advanced packaging technologies are extremely complex and demand manufacturing methods with exceptional precision in all process steps. Close control and optimization of all parameters ensure that quality and yield rates can be brought up to the required levels even in high volume environments. The only way to accomplish this is with manufacturing equipment that‘s equally precise and efficient.