Products from Solder Paste (Leaded Lead Free)

ALPHA CL-78 Solder Paste

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ALPHA CL-78 is a no-clean, dispensable solder paste compatible with the Alpha UP-78 series of modern, no-clean pastes. It is designed for high speed automated or manual dispensing through a wide range of needle sizes. The post reflow residues are clear and colorless....

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ALPHA CVP-360 Solder Paste

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ALPHA CVP-360 is a lead-free, halogen free no-clean solder paste designed for a broad range of applications. ALPHA CVP-360 is designed to enable the use of ALPHA SACX alloys, while offering reflow process yields comparable with higher silver SAC alloys (SAC 305 and SAC 405). CVP-360 also offers extremely high in circuit pin test yields, which can r...

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ALPHA CVP-390 Solder Paste

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ALPHA CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its exc...

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ALPHA CVP-520 Solder Paste

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ALPHA® CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceed...

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ALPHA JP-500 Solder Paste

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ALPHA® JP-500 is a lead-free, no-clean solder paste designed for use in Jet Printers. ALPHA JP-500 features a rheology capable of standard dispensing or jetting. ALPHA JP-500 is formulated to offer best in class in circuit pin test yields, high electrical reliability, all in a zero halogen flux formulation. Outstanding reflow process window delive...

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ALPHA OM-338 CSP Solder Paste

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ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields excellen...

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ALPHA OM-338 PT Solder Paste

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ALPHA OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-PTs broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process. ALPHA OM-338-PT yields excellent pr...

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ALPHA OM-338-T Solder Paste

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ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-T’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-T yields excellent print...

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ALPHA OM-340 Solder Paste

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ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, wit...

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ALPHA OM-350 Solder Paste

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ALPHA OM-350 is a lead-free, no-clean solder paste suitable for fine feature printing and reflow using most demanding soak reflow profiles in air and nitrogen atmospheres. The outstanding reflow process window of ALPHA OM-350 delivers good soldering on OSP-Cu, Immersion Ag, Immersion Sn, ENIG and Lead-Free HASL surface finishes. ALPHA OM-350s comp...

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ALPHA OM-351 Solder Paste

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ALPHA® OM-351 is a lead-free, Zero-halogen no-clean solder paste designed for applications where ultra low voiding performance, excellent ICT pin testing first pass yield, and the ability to pass JIS Copper Corrosion test are required. ALPHA® OM-351 engineered to enable consistent fine pitch printing capability, down to 220µm squares using a 100µm...

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ALPHA OM-353 No-Clean Lead-Free Zero-Halogen-ROL0-Ultra-Fine Features Printing And Air Reflow Capable Fine Powder Solder Paste

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ALPHA® OM-353 solder paste is designed for blend with Type 5 (15 – 25µm) powder to meet market segments requiring ultra-fine features application involving an air reflow environment. ALPHA® OM-353 solder paste is capable of providing excellent printing performance down to 180µm pad size dimension with a 60° angled squeegee on stencil at 50 mm/s sp...

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ALPHA OM-363 No-Clean, Halogen-free, Lead-free Solder Paste

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ALPHA® OM-363 is a lead-free, halogen-free, no-clean solder paste designed for minimizing BGA non-wet opens and head in pillow defects. This paste chemistry continues Alpha’s tradition of being an industry leader in providing excellent pin testing property for high first pass ICT yields. ALPHA® OM-363 solder paste is also designed to enable consis...

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ALPHA OM-5100 Solder Paste

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ALPHA® OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux vehicle is rheologically formulated to provide excellent repeatability and resistance to environmental conditions. The ALPHA OM-5100 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while...

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ALPHA OM-5300 Solder Paste

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ALPHA OM-5300 no clean solder paste was developed to meet the demands of tin lead soldering when lead free components are present in the circuit assembly. Like all ALPHA solder pastes, OM-5300 has excellent print volume repeatability to minimize variation in the print process. OM-5300 minimizes print cyle times through high print speeds and extende...

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ALPHA® OM-535 Low Melting Point No-Clean Lead-Free Halogen Free Solder Paste for Double Sided Single Reflow Application

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ALPHA® OM-535 is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attribute is excellent no-solder drip phenomena during the reflow process. ALPHA OM-535 solder paste version with ALPHA® SBX02 alloy, melting point below 140oC, has been successfully used with peak re...

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Alpha OM-6106 Solder Paste

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ALPHA® OM-6106, is a low residue, no-clean solder paste designed to maximize SMT line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and high-speed printing properties. The ALPHA® OM-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering ...

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ALPHA® PoP-33 Solder Paste

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To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP fl...

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ALPHA PoP 707 Solder Paste

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This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux. The rheology of the flux allows it to remain on the dipped spheres during post flux placement of sub-assemblies, while allowing for easy leveling of the flux bath. This flux was de...

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ALPHA WS-809 Solder Paste

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ALPHA® WS-809 is a SnPb, water-soluble which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. ALPHA® WS-809 is formulated for both standard and fine feature pitch stencil printing, at print speeds between 1”/sec (25 mm/sec) and 6”/sec (150 mm/sec) with stencil thicknesses of 5 mil (0.125 mm) to 6 mi...

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ALPHA WS-820 Solder Paste

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ALPHA® WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste. ALPHA® WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to i...

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ALPHA WS-852 Solder Paste

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ALPHA® WS-852 is a SnBiAg low temperature, water soluble solder paste designed for a broad range of SMT processes where aqueous post reflow cleaning is required. The low temperature, lead-free alloy enables lower temperature processing of surface mount technology. The SnBiAg alloy reflows between (160-190)oC. The carefully selected Sn/Bi/Ag ...

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