ALPHA WS-809 Solder Paste

ALPHA® WS-809 is a SnPb, water-soluble which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required. ALPHA® WS-809 is formulated for both standard and fine feature pitch stencil printing, at print speeds between 1”/sec (25 mm/sec) and 6”/sec (150 mm/sec) with stencil thicknesses of 5 mil (0.125 mm) to 6 mil (0.15 mm), particularly when used in conjunction with ALPHA® Stencils. Blade pressures should be between 1 – 2 lbs/in (0.16 – 0.34 kg/cm), depending on the print speed. The higher the print speed employed, the higher the blade pressure that is required.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

Refer Product Link Make An Enquiry
Excellent volume transfer efficiency over broad range of environmental conditions
Fine-pitch printing with consistent shape and volume to 16 mil pitch QFP (63x10x5 mil deposits) and 15 mil circles (BGA225)
High throughput and yield with consistent print volumes at print speeds ranging from 1–6 inches/second
Exhibits resistance to slumping and drying at temperature up to 66–84°F (19-29°C) and relative humidity extremes (35%-65% RH)
Water cleanable after two paste reflow cycles
Excellent low voiding performance that exceeds IPC Class III requirement
Superior solder spread performance on Cu OSP
Please contact us for more details.