ALPHA PoP 707 Solder Paste

This NO-CLEAN flux is engineered for use as a dip flux for BGA packages. It delivers even, reproducible volumes of flux onto spheres that have been dipped into the flux. The rheology of the flux allows it to remain on the dipped spheres during post flux placement of sub-assemblies, while allowing for easy leveling of the flux bath. This flux was developed to enable the pre-assembly of stacked BGA packages, prior to reflow.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

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Appearance Smooth, white to off-white paste
Viscosity (Spiral/Malcom) Typically 430 Poise @10 rpm @ 25°C
Tack strength (per IPC J-STD-004)
Initial 10.6 grams / sq mm, typical
6 hr @ 50% RH 8.3 grams / sq mm, typical
24 hr @ 50% RH 8.8 grams / sq mm, typical
Fineness of Grind <10 ?m
Acid Number (mg KOH/g) 140 – 170 (1st batch = 166.9)
Corrosivity Passes IPC Cu mirror, Cu corrosion
Halide Content Halide free (ROL0 per IPC J-STD-004)
Moisture Content < 1.0 % (w/w)
Specific Gravity 1.02 grams / cc
J-STD-004 SIR (pass > 108) 4.2 x 109 Ohms, 1 Day, un-cleaned
J-STD-004 SIR (pass > 108) 6.8 x 109 Ohms, 4 Days, un-cleaned
J-STD-004 SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned
BELLCORE SIR (pass > 1011) 7.3 x 1011 Ohms, 1 Day, un-cleaned
BELLCORE SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned
Electromigration (500 hours) 1.6 x 1011 Ohms, 96 hours
(BELLCORE) 4.0 x 1011 Ohms, 500 hours (pass: final > init /10)
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