ALPHA® OM-535 Low Melting Point No-Clean Lead-Free Halogen Free Solder Paste for Double Sided Single Reflow Application

ALPHA® OM-535 is a low temperature solder paste technology designed to enable a single reflow application for assembly of double sided board. Its key attribute is excellent no-solder drip phenomena during the reflow process. ALPHA OM-535 solder paste version with ALPHA® SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profiles between 155oC and 190oC. ALPHA SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA OM-535 provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through-hole components are used in an assembly. The benefits are increased daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. In addition it allows the desired obsolescence of an extra SMT process. These eliminations can significantly lower the cost of producing an electronic assembly. The alloys yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with ALPHA OM-535 must be lead-free to eliminate the formation of tin/lead/bismuth phase which has a melting point under 100ºC.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

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Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.
Reduces energy consumption in reflow ovens versus standard lead free alloys.
Reduces reflow process cycle time.
Delivers 8+ Hour stencil life.
Potential elimination of bar solder, wave soldering flux and energy costs associated with wave soldering.
Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
Excellent resistance to random solder balling- minimizing rework and increasing first time yield.
Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates.
Delivers very high in-circuit pin test yields, minimizing costly false negative test results.
Compatible with either nitrogen or air reflow.
Possess excellent solder drip resistance during reflow.
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