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Quick start up and simple product substitution from current material
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Print Consistency: Lower “deposit to deposit” variation drives maximization of first pass print & reflow yields
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Print Repeatability: Lower variability after production dwells, ensuring a continuous production flow with minimized level of insufficient solder joints
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Solder Ball Reduction: Minimizing both mid chip and random solder balls helps to maximize reflow yields
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Excellent Solder Spread: Compatibility with a variety of pad and lead finishes drives overall cosmetics & yields up
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Excellent response to pause performance, generating less defects due to start up
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High print speed, up to 150 mm/sec (6 inch/sec)
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Efficient activation system providing defect free soldering with a wide range of oven profile
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Low residue level with minimal spread for reliable underfilling processes and results
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Excellent reliability properties, halide-free material
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