ALPHA OM-340 Solder Paste

ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

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Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200µm (8 mil) with 100µm (4 mil) thick stencils
Excellent print consistency with high process capability index across all board designs
Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
Wide reflow profile window with good solderability on various board / component finishes
Excellent solder and flux cosmetics after reflow soldering
Best in class low defect rate for Head in Pillow
Best in class in circuit pin test yield
Reduction in random solderballing levels, minimizing rework and increasing first time yield
Meets highest IPC 7095 voiding performance classification of Class III
Excellent reliability properties, halide-free material
Compatible with either nitrogen or air reflow
Zero halogen (No halogen intentionally added to the formulation)
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