ALPHA OM-338 CSP Solder Paste

ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-CSP is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-CSP’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. *Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

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Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.24mm (0.096”) with 0.100mm (4mil) stencil thickness.
Excellent print consistency with high process capability index across all board designs.
Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
Wide reflow profile window with good solderability on various board / component finishes.
Excellent solder and flux cosmetics after reflow soldering.
Reduction in random solderballing levels, minimizing rework and increasing first time yield.
Meets highest IPC 7095 voiding performance classification of Class III.
Excellent reliability properties, halide-free material.
Compatible with either nitrogen or air reflow
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