ALPHA® EF-9301 is a rosin-containing full dulling flux that provides the unique attributes of excellent solderability and reliability in both Lead-Free and Tin-Lead processes. It is designed to have best in class bridging on bottom side SMT components as well as superior performance in hole fill and solderballing. Additionally, it provides dull joints with an evenly spread, low-tack flux.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

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Low bridging performance on connectors and bottom side SMT components
Excellent hole fill demonstrated by >95% yield on 10 mil holes.
Low solderballing performance
Smooth solder joints with full dulling
Evenly spread, low tack, flux residue
Capable for Tin-Lead and Lead-Free processes
Can be applied via spraying or foaming
Please contact us for more details.