ALPHA EF-8300 Wave Solder Flux

ALPHA EF-8300 is a rosin-containing, alcohol based flux designed to optimize solderability and reliability. It is formulated for both standard and thicker, high-density PCBs in both Lead-free (standard SAC and Low Ag SAC alloys) and eutectic tin/lead processes. It is designed to have low bridging n bottom side QFPs, as well as provide superior performance in hole-fill and solderballing. Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue.

Availability: In Stock

Condition: New

Brand: Cookson Electronics

Refer Product Link Make An Enquiry
Good hole-fill demonstrated by >96% yield on 10 mil holes.
Low bridging performance on connectors.
Good micro-solder ball performance in Lead-Free applications
Pin testable
Specifically designed for use on Cu-OSP PCBs
Excellent Lead-Free soldering performance on various board finishes.
Evenly spread, tack free residue.
Capable for high density as well as general purpose Lead-Free soldering processes.
Can be used in Pb free or Sn/Pb processes
Please contact us for more details.