KISS-102IL In-Line SMEMA PCB 16" X 16"

The KISS-102IL maintains the PCB stationary during the soldering process preventing components from toppling over causing “unset” inter-metallic fillets. The KISS-102IL is a fully automated selective soldering machine using the proven ‘traveling mini–solder wave”, featuring the “Super fast” robotic motion to maximize production. The KISS-102IL is used to flux and solder through hole components on SMT boards within close proximity of adjacent components. The KISS-102IL overcomes the limitations of operator dependent soldering with a truly flexible automated flux application and molten solder delivery system. The KISS-102IL couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including immersion depths, pre-heat dwells, travel distances and speeds, solder temperature and wave height. Once set, the system will repeat precisely.

Availability: In Stock

Condition: New

Brand: Ace Protech

Refer Product Link Make An Enquiry
Additional Automated Spray Fluxing System
Real Time Top Side PCB Pre-Heating System
N2 Bottom-side Spot Pre-Heater
Single or Dual Drop Jet Fluxing System(s)
Drop-jet Verification
De-bridging Nitrogen Jet
Closed Loop Position with Linear Encoders
Over Conveyor Barcode Reader
Additional Solder Pot/Pump Assembly Lead, Lead Free and HMP Lead Alloys
All Standard KISS Bullet and Wave Nozzles
75mm Wave Nozzle Pump Assembly: Lead, Lead Free and HMP Lead Alloys
Dual Nozzle Pot/Pump Assembly; Lead, Lead Free and HMP Lead Alloys
Solder Pot Service/Exchange Cart
Ultra Pure Nitrogen Generators
KISS Pump Maintenance Kit
Six Channel Data Logging System for Preheat Temperature Profiling
Board Warp Compensation
Process Overview
 
The automated process begins with the PCB/panel entering the KISS-102IL on the edge rail conveyors built into the sys-tem in normal SMEMA fashion. The PCB is clamped flat into location. The “Automated Fiducial Correction”identifies the location of 2 points on the board and resets the “0” start position. The cycle begins by applying flux precisely to all the sites to be soldered. Next the mini solder wave is automati-cally moved under the components to be soldered. The sol-der nozzle raises to just below the site allowing the heated nitrogen to pre-heat the site and activate the flux. The nozzle raises up further immersing the first of the leads, dwelling for initial “soak”. The nozzle travels over the entire site leaving perfect top and bottom side fillets at each pin. At the comple-tion of the travel the solder pot lowers and moves to the next site. After completing all sites the pot returns to the start posi-tion ready for the next cycle while the completed PCB/panel conveys out, downstream.
 
 
Please contact us for more details.