KISS-103 Manual Load PCB 24" X 18"

The KISS-103 is an automated, simple to use low cost selective soldering machine using the proven ‘traveling mini–solder wave”, featuring the “Super fast” robotic motion to maximize production. It is used to flux and solder through hole components on SMT boards within close proximity of adjacent components. This process overcomes the limitations of operator dependent soldering with a truly flexible automated flux application and molten solder delivery system. The KISS-103 couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including immersion depths, pre-heat dwells, travel distances and speeds, solder temperature and wave height. Once set, the system will repeat precisely.

Availability: In Stock

Condition: New

Brand: Ace Protech

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Additional Process Witness Camera
Dual LCD Monitors
Additional Automated Spray Fluxing System
Real Time Top Side PCB Pre-Heating System
N2 Bottom-side Spot Pre-Heater
Single or Dual Drop Jet Fluxing System(s)
De-bridging Nitrogen Jet
Drop-jet Verification
Closed Loop Position with Linear Encoders
Hand Held Barcode Reader
Additional Solder Pot/Pump Assembly Lead, Lead Free and HMP Lead Alloys
All Standard KISS Bullet and Wave Nozzles
75mm Wave Nozzle Pump Assembly: Lead, Lead Free and HMP Lead Alloys
Dual Nozzle Pot/Pump Assembly; Lead, Lead Free and HMP Lead Alloys
Universal PCB Location Fixture; Data Sheet to come…..
Skyhook Fixture Data Sheet / Instruction Manual
Solder Pot Service/Exchange Cart
Ultra Pure Nitrogen Generators
KISS Pump Maintenance Kit
Six Channel Data Logging System for Preheat Temperature Profiling
Board Warp Compensation
Process Overview
The operator places the PCB onto the location rails and starts the automated cycle. The “Automated Fiducial Correction”identifies the stat point. The cycle begins by applying flux to all the programmed sites. Next the mini solder wave is auto-matically moved under the component to be soldered. The solder nozzle raises to “wet” the first pins. The solder wave travels the length of the component soldering the through hole leads to the PCB. At the completion of the travel the sol-der pot lowers and moves to the next site. All programmed sites are soldered in the same cycle. An automated stepping function allows solder arrays of boards in an X-Y matrix. After completing the cycle the pot can be programmed to return to the start position ready for the next cycle.
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